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SEMICON SOUTHEAST ASIA
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Where Seamless Automation meets Advanced Intelligence
Engineering motion that powers semiconductor manufacturing
As semiconductor manufacturers face increasing pressure to improve yield, reliability, and time-to-market, intelligent automation plays a critical role. Festo supports these challenges with proven automation solutions backed by over a century of engineering excellence. At SEMICON SEA 2026, Hall 8 Level 2, Booth #2165 held from 5–7 May at the Malaysia International Trade and Exhibition Centre (MITEC), Festo will present practical applications and technologies that help manufacturers optimise performance and create sustainable production value.
Experience a tailored visit at SEMICON SEA 2026
Pre-register your slot to guided booth tour, expert-led sessions, and exclusive networking with global experts and senior management.
Exhibition Highlights
Wafer warpage solutions
A non‑contact, high‑precision pressure‑control solution designed to address wafer and substrate warpage in advanced semiconductor processes. It combines digital and piezo technologies to deliver accurate multi‑channel pressure control and supports customised chuck design for faster validation.
Advanced packaging process solution for dispensing adhesive and laminating heat sinks
An integrated solution that automates adhesive application, transport, heat‑press curing, and bonding with closed‑loop force control. It ensures precise pressure, accurate vacuum control, and real‑time monitoring for high‑quality advanced packaging outcomes.
Wafer handling
A compact solution for precise wafer loading, transfer, and positioning in EFEM systems. It features cost‑efficient inverted‑gantry handling, fast alignment, gentle valve control for vacuum processes, secure pneumatic lifting, and micrometer‑level positioning within a modular, easy‑integrate design.
Solution for Semiconductor Industry
Precision Motion Control
Micorn-level positioning with compact servo systems. Ensures stable, repeatable wafer handling and controlled motion profiles under high-speed conditions.
High-speed Valve & Vacuum Solutions
Fast switching response with consistent performance. Optimised air consumption and stable vacuum control for yield-critical handling applications.
Scalable Automation Architecture
Modular platform with seamless connectivity. Reduces integration complexity while supporting flexible system expansion and long-term scalability.
Experience a tailored visit at SEMICON SEA 2026 with exclusive product highlights and dedicated discussions with our automation experts. Meeting availability during the exhibition can be limited. To ensure seamless experience, we recommend pre-booking a session with our experts at Hall 8 Level 2, Booth #2165.
